Test Socket
Test Beyond 100 GHz with Confidence.
The VAI KH3S™ High-Speed Shielded Socket combines advanced coaxial contact technology with superior RF shielding to provide outstanding signal integrity, reduced noise, and reliable performance for next-generation semiconductor devices.
| Electrical Specification (Simulation) | ||
|---|---|---|
| Insertion Loss S21 simulated | -1dB to | >100 GHz |
| Return Loss S11 simulated | -20 dB to | 21.2 GHz |
| Forward crosstalk simulated | <60 dB to | 100 GHz |
| Near end crosstalk simulated | <66 dB to | 100 GHz |
| Impedance ( coax calculated) | 50.7 Ohms | |
Test Socket
High-Speed Test Socket
Optimized for semiconductor applications requiring high bandwidth, low signal loss, and consistent electrical performance. Supports frequencies up to 40 GHz with customizable solutions for diverse package types.
| Electrical Specification | |
|---|---|
| Current Rating | 3.5 Amp |
| Bandwidth @-1dB | 40Ghz |
| Capacitance | 0.39pF |
| Inductance | 0.81nH |
| Propagation Delay | 17.4psec |
| Contact Resistance | 25 mOhm |
| Impedance | 44.5Ohm |
Test Socket
Ultra-Low Inductance. High-Speed Performance.
Optimized for semiconductor applications requiring high bandwidth, low signal loss, and consistent electrical performance. Supports frequencies up to 40 GHz with customizable solutions for diverse package types.
| Electrical Specification | |
|---|---|
| Current Rating | 2.Amp max drive |
| Bandwidth (GSG) | 46.8 Ghz @-1dB |
| Bandwidth (Cross Ground) | 55.9 Ghz @-1dB |
| Bandwidth (Full Ground) | 57.3 Ghz @-1dB |
| Mutual Capacitance | 0.02pF |
| Mutual Inductance | 0.11nH |
| Self Inductance | 0.44nH |
| Contact Resistance | < 75 mOhm |
Test Socket
High-Voltage Socket Technology
Optimized for power semiconductor testing, featuring robust insulation, low leakage current, and exceptional reliability for high-voltage applications.
Test Socket
High-Current Kelvin Test Sockets
Designed for accurate power device testing, Kelvin sockets feature separate force and sense contacts to eliminate measurement errors caused by contact resistance. Supporting up to 9A pulse current, deliver precise, reliable performance for power semiconductor, automotive, and industrial applications.
| Electrical Specification | |
|---|---|
| Current Rating | 3A 2 min Continuous &10% spring force reduction |
| Self Inductance | 0.58nH |
| Capacitance | 0.60pF |
| Bandwidth | 11.10Ghz@-1dB |
| Propagation Delay | 50.29ps |
Test Socket
Non-Magnetic MEMS Test Sockets
Designed for MEMS gyroscopes and sensitive sensor applications, VAI's non-magnetic test sockets minimize magnetic interference while delivering reliable electrical performance, accurate measurements,
Test Socket
Side-Contact Test Sockets
Designed for modular and edge-contact devices, side-contact test sockets provide reliable electrical connections, precise alignment, and consistent test performance.
Test Socket
Turret Handler Contactors
VAI's custom turret handler contactors are engineered for reliable, repeatable semiconductor testing. Designed for high-volume production environments, they provide precise alignment, stable electrical performance, and long service life across a wide range of semiconductor devices and package types.
Test Socket
Kelvin BGA Socket with Flat-Tip Contacts
Featuring precision flat-tip contact, VAI's Kelvin BGA socket delivers stable contact performance, minimizes solder ball marking, and ensures excellent repeatability for advanced BGA device kelvin testing.
Test Socket
50-Site LGA Gas Sensor Socket
Custom 50-Site LGA Gas Sensor Socket with integrated gas distribution channels, designed to provide uniform gas exposure, reliable electrical contact, and high-throughput testing for sensor applications.
Test Socket
Compact PoP Socket for BGA169
Space-efficient socket design optimized for 12 x 12 mm BGA169 PoP devices. Delivers reliable contact performance, precise alignment, and maximum board space utilization for high-density test applications.
Test Socket
Open Top Zero Insertion Test Socket
Designed for fast device handling and reliable testing, VAI's Open Top ZIF Socket enables quick device loading without insertion force, protecting delicate packages while ensuring consistent contact performance.
Test Socket
BGA Socket - More Than 3,000 IO
VAI's high-density BGA socket supports devices more than to 3,000 I/O connections, providing precise alignment, reliable contact performance
BGA Mulit Test Site Socket
Test Socket
Types of Socket
Pogo Pin
QFN socket
Multi test sit Socket
Multi test sit Socket
WLCSP socket
QFN kelvin socket
Ultra Miniature Device socket
Connector
QFN socket
Socket for VQFN
( Contact finger)
Multi test sit Socket
Socket for QFP
(contact finger)
Socket for SOIC 8 and 16
(contact finger)
Socket for TSSOP
(contact finger)
Socket for TSSOP
(contact finger)
Kelvin Socket for SOIC
(contact finger)
VAI Proprietary Contact finger
Socket for TQFP
(contact finger)
Socket for VQFN
( Contact finger)
Socket for QFP
(contact finger)
Socket for SOIC 8 and 16
(contact finger)
Socket for TSSOP
(contact finger)
Socket for TSSOP
(contact finger)
Kelvin Socket for SOIC
(contact finger)
VAI Proprietary- Flat finger
VAI Proprietary K Pin
Test Socket
Socket: Pogo pin
QFN socket
Multi test sit Socket
Multi test sit Socket
WLCSP socket
QFN kelvin socket
Ultra Miniature Device socket
Connector
Test Socket
Socket: VAI Proprietary Contact finger
Socket for TQFP
(contact finger)
Socket for VQFN
( Contact finger)
Socket for QFP
(contact finger)
Socket for SOIC 8 and 16
(contact finger)
Socket for TSSOP
(contact finger)
Socket for TSSOP
(contact finger)
Kelvin Socket for SOIC
(contact finger)
Test Socket
Socket: VAI Proprietary- Flat finger
Socket for TSSOP
( contact finger)
MSOP-8 Kelvin
( contact finger)
Test Socket
Socket: VAI Proprietary K Pin
Socket for SOT 5 & 6 Lead
( KS Pin)
Socket for SOIC
( KS Pin)
Kelvin Socket for SOIC
( K Pin）
Non Magnetic Q Socket Kelvin contact
( K pin)
Socket for TO package
(K Pin)
Socket for QFN
( KT Pin)
