VAI Test Socket

VAI has many years experience in semiconductor test application, at VAI we offer test socket and contactor, a unique solutions for various type of devices. We design and manufacture a broad product range-from sockets for RF, WLCSP, MEMS Gyroscope non-magnetic, Micro Lead Frame packages, High Power device to high-speed ASICs with more than 3,500 IO.
 
VAI socket design process covers several rigorous phases, our design team customize test socket using state-of-the-art computer-aided design (CAD) tools, including 3D mechanical modeling, for the socket design. We work closely with customer and involve with all phases of customer test project. After customer approval of designs, the product goes into computer-aided manufacturing (CAM) for fabrication. We also provide load board footprint design if customer does not already has load board design.
 
FEATURES
  • Designed to fit Module.
  • Allows for easy insertion and removal of module for upgrade, replacement and repair.
  • Eliminates damage to valuable PCB.
  • Perfect for high volume production applications and prototypes.
  • Good compliance between the device & contacts.
  • Uses a special surface mounting to your printed circuit board.
  • Special prototyping adapters designed on request allowing socket to be plugged onto standard prototyping boards.
  • The Socket material allows for device alignment with high wear resistance & low thermal coefficient of thermal expansion.
  • The socket body utilize coarse & fine alignment with tapered guides to ensure ease of entry.
 
 
APPLICATIONS
- Hand-Test
- Prototyping
- Qualification
- Development
- Device Stability
- Mass Production
- Future Upgrades
- Allocation Issues
  MATERIALS
- Torlon 4203
- Torlon 5530
- Ceramic Peek
- Vespel
- Semitron
- Krefine
- Ultem 2300
  LEAD PITCH
- Smaller pitch 0.4mm

COMPLIANCE
- RoH Compliance
 
SOCKET DEVICE TYPE
  • BGA, uBGA, VFBGA, FCTEBGA, WLCPS, LFBGA,QFP, QFN, VFQFN, VQFPN, LGA, TQFP, VQFN, ,FPBGA, MLP, WPLGA, LGA, CSP, SIP, WLCSP
  • SOT package, TO Package, (TO package with Kelvin contact) SOIC package (SOIC with Kelvin contact) TSOP package, SOP, MSOP
  • Edge card, Strip test socket
  • Kevin, non Kevin contact
  • Non magnetic socket for MEMS Gyroscope
     
 
     
 
     
 
     
 
     
 
     
 
     
 
     
 
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